Handling and separation of thin and light workpieces such as film, paper, veneer, without permanent deformation of the workpiece
Handling highly air-permeable workpieces, such as printed circuit boards that do not have electronic components installed
Handling delicate parts such as wafers and cells
Direct mounting via 4 screws at the top (1)
Vertically compressed air connection hole (2)
Horizontal compressed air connection hole (closed with plug)
Aluminium electroplated body, built-in Bernoulli nozzle (3)
There are two types of fluid chambers: the standard SF is suitable for suction of airtight workpieces; the high-flow HF can improve the higher gas leakage compensation and is suitable for suction-breathing workpieces (4)
The bottom of the suction cup is made of a non-marking rubber cushion which made of special material HT1 (5)
Optional center support structure
Five advantage as following:
No additional vacuum generator required, just connect the compressed air
High temperature, no traces, to withstand lateral forces
Non-contact transportable workpieces, good leak compensation
Separation of lightweight, breathable workpieces
Handling wafers and cells gently
